As of the end of June 2021, the company has completed a new round of expansion projects, and the total production capacity has increased by 50% compared to 2020, laying a solid foundation for future development.

From the explosion of large model AI to the popularity of high-density complex computing in many industries, the demand growth of high-power chip market has been driven. Computing infrastructure has also emerged a new development trend, such as cloud computing dedicated chips, high-performance edge computing equipment, the rapid development of new application scenarios, and the stock computing market together constitute the future market blue ocean of chip manufacturing. In the manufacturing of finished chip products, Chiplet technology has become an important choice in the emerging high-computing demand scenario. In this field, Changdian's XDFOI Chiplet high-density multi-dimensional heterogeneous integration series process has entered a stable mass production stage.

Looking forward to the second half of the year, the semiconductor industry will still face greater pressure. The latest industry forecast released by the World Semiconductor Trade Statistics Organization (WSTS) shows that global semiconductor sales will decline by 10.3 percent in 2023, then rebound and grow by 11.9 percent in 2024. Changdian Technology said that it will adhere to the long-term perspective, continue to promote the optimization of product structure to high value-added applications such as high-performance computing, automotive electronics, industrial intelligence, and do a good job in the active transformation of business structure to high value-added and high-performance packaging to promote the company's stable development.