While the "Changdian Micro" project is progressing steadily, Changdian Technology has also made a breakthrough in the layout of automotive electronics. The automotive chip finished product manufacturing project was officially signed in April this year, and recently successfully won the industrial plot, which will be settled in Shanghai Lingang. The planned products of the project cover the market hot spots such as intelligent cabins, intelligent interconnection, safety sensors and module packaging types in the new four semiconductor fields. In recent years, Changdian Technology has achieved rapid expansion in the field of automotive electronics. According to the financial report, its automotive electronics revenue in 2022 increased by 85% year-on-year; in the first quarter of 2023, the revenue of automotive electronics business increased by 144 year-on-year.

In addition, Changdian Technology continues to introduce innovative solutions based on high-performance packaging technology and process capabilities in response to the differentiation of application scenario requirements. This year, the company set up the "Industrial and Intelligent Application Division". Through the technology development mechanism with the overall solution as the core, the company has successively launched overall solutions for 5G RF power amplifier, high-performance computing system, multi-scene intelligent terminal, etc. to provide customers with one-stop and customized technologies and services, and accelerate the market development in HPC high computing system, energy storage and power management, intelligent terminal module and ecosystem.