In November 2021, the company completed the mass production of high-density ultra-thin (thickness 0.375mm) advanced packaging product production line.

In recent years, it has accelerated its deployment from consumer products to high-power chips, automotive-grade products, 5G communications and other fields with rapid market demand. This year, under the overall market downturn, it has continued to focus on key areas and made positive progress in technology, production capacity and product upgrading.

Strengthen high-performance package layout, long-electric microelectronics wafer-level microsystem integration high-end manufacturing project recently capped as scheduled. The project is a high-end production capacity layout for global customers in the fast-growing market demand for high-performance computing (HPC) and artificial intelligence. The project focuses on 2.5 high-performance packaging technologies such as D/3D high-density wafer-level packaging, which can provide one-stop service from package co-design to chip production.